Updated December 21st, 2023 at 10:49 IST
Samsung to establish chip packaging research unit in Japan
Earlier reports from March suggested that Samsung was considering the establishment of a packaging facility in Kanagawa prefecture.
Samsung Electronics is set to establish a cutting-edge chip packaging research facility in Japan, investing approximately 40 billion yen ($280 million) over the next five years.
The city of Yokohama announced this move, confirming Samsung's intention to delve into advanced chip packaging research.
Earlier reports from March suggested that Samsung was considering the establishment of a packaging facility in Kanagawa prefecture, leveraging existing ties with Japanese chipmaking equipment and materials manufacturers.
The decision aligns with the broader trend of global companies collaborating to counter China's growing technological influence, with tensions between South Korea and Japan showing signs of easing.
In the competitive landscape of semiconductor technology, companies are actively pursuing breakthroughs in advanced packaging techniques. These techniques involve integrating various components into a single package to enhance overall chip performance.
Samsung's investment in this Japanese facility not only signals its commitment to technological advancement but also aims to strengthen its leadership in the chip industry.
Furthermore, by partnering with Yokohama-based companies specialising in packaging-related technologies, Samsung seeks to foster innovation and maintain a competitive edge in the dynamic semiconductor market.
The head of Samsung's chip business, Kyung Kye-hyun, stressed the facility's role in enhancing collaboration and leadership in the ever-evolving field of chip development.
(With Reuters Inputs)
Published December 21st, 2023 at 10:35 IST